33

Damage mechanisms during lapping and mechanical polishing CdZnTe wafers

Year:
2010
Language:
english
File:
PDF, 863 KB
english, 2010
34

Residual stress analysis on silicon wafer surface layers induced by ultra-precision grinding

Year:
2011
Language:
english
File:
PDF, 483 KB
english, 2011
42

Anisotropic Damage Mechanism during Grinding of CdZnTe Wafers

Year:
2010
Language:
english
File:
PDF, 1.89 MB
english, 2010
50

Effect of Mechanical Anisotropy on Grinding of CdZnTe Wafers

Year:
2010
Language:
english
File:
PDF, 1.49 MB
english, 2010